microPREP™

使用激光进行用于微结构诊断的样用品制备

全新的microPREP™ 系统的开发旨在提供高效的激光样品制备工艺,以满足微结构诊断和故障诊断的需求。

可以使用它加工复杂的3D形状样本,以便对高级封装中的某些结构进行更全面的分析,例如透过硅通孔(TSV),甚至是完整的系统级封装(SiP)进行分析。此外,通过皮秒微加工处理更大尺寸的、微米级精度的样品是非常理想的,可保证几乎不损坏结构,且没有元素污染。

microPREP™ 系统的模块化软件,确保可以高度灵活地设置样品加工流程,适用于各种微结构诊断技术。除了提供参数设置(配方)和标记样品功能以便于进行跟踪监测之外,这种新工艺与纯离子束工艺相比,烧蚀速率高了三个数量级。

通过不断的开发,microPREP™ 目前适用于扫描电子显微镜(SEM)、传输菊池衍射(TKD)、透射电子显微镜(TEM)、X射线显微镜(XRM)、原子探针断层扫描(APT)、微机械测试以及可承受高高功率激光烧蚀的其他应用。

在进行大批量样品制备,亦或者为了避免额外的清洁过程时,还可对microPREP™ PRO 系统额外装配概览摄像头和二氧化碳雪花喷射清洁装置,用于减少采样时间。

联系我们

请联系我们的技术销售团队,获取更多资讯!

Boris Rottwinkel
Tel: +49 371 40043-222
sales@3d-micromac.com

科研出版物

2018

TEM sample preparation workflow using laser ablation and broad ion beam milling.
2018, Poster, IMC19 – (Takanori Sato, Jacob Byrnes), Australian Centre for Microscopy & Microanalysis, The University of Sydney.

A combined laser ablation/focused ion beam approach to atom probe sample preparation.
2018, Poster, IMC19 – (Jacob Byrnes, Ingrid McCarroll, Katja Eder, Limei Yang, Julie Cairney), The University of Sydney.

Laser preparation of semiconductor devices for failure analysis.
2018, 11. Jenaer Lasertagung (3D-Micromac, Infineon, Thales, FhG-IMWS-CAM).

Laser-Micromachining for Failure Analysis: from TEM Sample Preparation to Large Area SEM Inspection.
2018, 7th CAM Workshop (3D-Micromac, Infineon, Bosch, FhG IMWS-CAM).

Rapid and localized ion-beam etching of surfaces using initial notches
2018,  Micron – (Busch, R.; Krause, M.; Coyle, S.; Höche, T.).

An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation
2018, Microscopy and Microanalysis – (Zhao, W.; Bennett, C.; Sairam Pichumani, R.; Walker, G.; Eaton, K.; Hassel Shearer, M.; Dumas, L.; Brooks, I.; Wang, Y.).

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
2018, IEEE 68th ECTC – (Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.).

Nanoscale 3D X-ray Microscopy for High Density Multi-Chip Packaging FA
2018, ISTFA – (Schmidt, C.).

2017

Combination of precise laser and FIB milling for TEM based IC failure analysis
2017, ESREF – (F. Altmann, M. Simon-Najasek, S. Hübner, M. Lejoyeux).

Pico-Second Laser and Broad Argon Beam Tools for Characterization of Advanced Packages and Devices
2017, ISTFA – (Hassel Shearer, M.).

Pico-Second Laser and Broad Argon Beam Tools For Characterization Of Advanced Packages And Devices
2017, EFUG Workshop – (Richard, V.;Hassel Shearer, M.).

Novel sample preparation and High-Resolution X-ray tomography for Package FA
2017, IPFA – (Schmidt, C.; Kelly, S. T. ; Ying Wang ; S. T. Coyle ; Michael Hassel Shearer).

2016

Laser based sample preparation for advanced packaging application
2016, EFUG – (Höche, T.; Krause, M.).

microPREP: A new laser tool for high-volume sample preparation
2016, IPFA Manuscript – (Wagner, U.; Petsch, T.; Krause, M.; Höche, T.).

2015

A Novel Laser Tool for High-Volume Sample Preparation
2015, Laser-Technik-Journal (Thomas Höche , Michael Krause , Martin Ebert , Uwe Wagner , Mandy Gebhardt).

New Approach of Laser Processing of Transparent Materials
2015, Lasers in Manufacturing Conference – (Werner, M.; Zimny, R.; Grimm, M.).

2014

microPREP – a new laser tool for high-throughput sample preparation
2014, 40th ISTFA (Krause, M.; Ebert, M.; Höche, T.; Wagner, U.).